OEM for PMMA, MS and LGP

Are you still troubled owing to the printing screen of long production time and the revision of high costs?

1. Laser dotting can be easy processing, real-time inspection and real-time revision.
2. The chromatic aberration on LGP are less than 1%.
3. Reducing the optical development costs, revision no more afraid.
4. No dot shrinkage, swap points and ink variation and other issues, and reproducibility is better.

LED Cutting

We provides LED laser cutting sample test services.

Laser cutting processing can replace traditional wheel cutting, and easy to reduce the width of the lanes to 30um, and the cutting speed can reach 100mm / s or more. Laser cutting, do not need others supplies and coolant exact charges. Welcome to call LED laser cutting proofing and foundry services, thank you.

Wafer Drilling/Cutting

Division of the laser drilling / cutting machine integration precision adjustment each component of optical, mechanical and electrical to achieve the micron-level accuracy, especially the UV laser light source for PCB drilling, flexible circuit board drilling or all kinds of wafer drilling / dicing, etc., to meet the needs of the industry foundry. The process optimization, technology integration for laser light parameters, beam modulation, focusing optical parameters, control and optimization of mechanical and electrical parameters for the combination of commissioning, and then using double-sided high aspect ratio laser processing. Beacuse of two-way processing technology in the double-sided front and back drilling, that can enhance the high aspect ratio and flatness.